Recently, I reviewed the progress of domestic substitution in the semiconductor field and found that domestic companies have made breakthroughs in several links along the path of advanced chip manufacturing processes.

First, on the equipment side. North Huachuang's etching and PVD platforms are quite comprehensive, and Advanced Micro-Fabrication Equipment Inc. (AMEC) has validated 5nm dielectric etching. TuoJing Technology's ALD technology for thin film deposition is quite good, and Huahai Qingke specializes in CMP equipment, serving both logic and memory applications. Shengmei Shanghai's cleaning equipment covers a wide range, and Xinyuan Micro has made moves in front-end coating and development. Additionally, Jingce Electronic's measurement instruments involve panel and semiconductor fields, while Changchuan Technology's testing equipment can handle both analog and digital chips.

In materials, there are also some key players. Hoshine Silicon Industry supplies 12-inch silicon wafers to SMIC, and Anji Micro's polishing solutions are advanced products supporting CMP. Jiangfeng Electronic provides high-purity targets used in memory and logic processes. Dinglong Coatings produces polishing pads, supporting the material platform. Nanda Optoelectronics focuses on ArF photoresist MO sources, and Yake Technology has strong precursor technology and has also completed overseas integrations. Jianghua Micro develops high-purity reagents, extending from panel to semiconductor fields.

In components and subsystems, Fuchuang Precision's metal structural parts have passed platform certification, and Xinlai Yingcai's vacuum tube valves have obtained SEMI certification. Hanzhong Jingji's dry pumps are making good progress in domestic substitution. Yingjie Electric's RF power supplies provide significant support for etching processes, Huaya Intelligent produces precision structural parts directly supporting equipment manufacturers.

On EDA and design tools, Huada Jiutian's analog EDA toolchain is quite complete, and Kelun Electronics has advantages in device modeling and parameter accuracy. Chipone Technology mainly focuses on IP licensing and platform services, while Guangli Micro concentrates on yield improvement and electrical testing.

In manufacturing and packaging/testing, SMIC continues to invest in expanding mature process capacity and specialized processes. Huahong's power and MCU products cover 8-inch and 12-inch capacities. Changdian Technology's advanced packaging capabilities are pushing Chiplet solutions, with Tongfu Microelectronics collaborating with AMD, and FC production lines are in mass production. Huate Technology specializes in automotive-grade packaging and testing, and Fan-out technology is also advancing.

The entire industry chain—from upstream equipment, materials, components, to midstream EDA tools, and downstream manufacturing and testing—has basically formed a complete domestic system framework. Of course, there are differences in technological depth and market position among companies, but this trend is indeed progressing.